LightMachinery offers contract manufacturing services that leverage our excimer and CO₂ laser systems to process customer parts with unmatched precision and repeatability. Whether you need short-run prototyping or scaled production, our applications lab and production team deliver high-quality results quickly and cost-effectively.

Our Laser Processing Capabilities

• Excimer Lasers (193–351 nm): Deep-UV micromachining for fine features, mask projection, and minimal heat-affected zones.
• TEA CO₂ Lasers (9.3 μm & 10.6 μm): High-power infrared machining for polymers, coatings, and other non-metallic materials.

Typical Applications

• Precision hole drilling and via formation
• Polymer film and flexible circuit cutting
• Medical device components (e.g., catheter holes, stent patterns, bioabsorbable materials)
• Pharmaceutical capsule drilling for controlled release
• Surface patterning, cleaning, and selective layer removal

Why Choose LightMachinery?

• Decades of expertise: Our engineers are veterans in laser micromachining across multiple industries.
• Complimentary sample testing: We’ll process your parts to prove feasibility before you commit.
• Flexible engagement: From one-off R&D trials to production volumes.
• Quality assurance: Reliable, consistent processing backed by LightMachinery’s laser technology.

Get Started

Ready to see how laser micromachining can improve your products? Contact our applications team today to discuss your part requirements and request complimentary sample processing.

35 micron x 14mm slit cut with the excimer laser in our lab

35um wide slit - zoomed on to display the edge quality

Bifilar solid core wires, 0.014" wire diameter, 0.003" thickness insulation, stripped with an IMPACT TEA CO2 laser

The high absorption of the 9.3 µm wavelength in most polymer materials, combined with the short pulse duration of TEA CO2 lasers, means that Impact lasers mimic the photo-ablative excimer process of excimer lasers, at ~50% of the capital cost, <10% of the operating cost, and generally higher throughput.

Ceramic chip capacitor marking, very small character sizes, high throughput, good contrast on most ceramics. Excimer marking is normally integrated into an automated test handler.

An excellent example of the quality and precision achieved by the excimer laser drilling plastic. This is 75 micron thick polyimide with 50 micron diameter holes.

Excimer laser wire stripping a single 50um wire with polyimide insulation

Excimer laser wire stripping of multiple wires, 50um wire diameter, Polyimide insulation

Heavier Gage wire stripping. 14 gage wire, 2mm in diameter, insulation 12 microns thick. Wire has been stripped only from one side a common requirement that is easily accomplished with the excimer laser.

SEM picture of a beautiful round 50 micron hole drilled in a printed circuit board. These via holes are drilled through a top copper layer, through the board insulation down to the copper layer below. Once the hole is plated it creates an electrical connection between tracks on different board layers.

A variety of brake line tubes stripped with the TEA CO2 laser - photo courtesy of 4Jet

Here is the same hole drilled through the top copper layer and the fiberboard down to the next copper layer shown at 500X

50um holes drilled in a copper clad printed circuit board